Detailed properties
Manufacturer | TE Connectivity | Date Code | 23+ |
Package | Quantity | 45000 |
description:
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NX2012SA-32.768KHZ-STD-MUB-2 | NDK | 23+ | 45000 | Contact | |
HI3556RBCV200 | Hisilicon | 20+ | 1190 | BGA | Contact |
AP6356S | AMPAK/正基 | 23+ | 15000 | QFN-44 | Contact |
RK3399 | Rockchip | 23+ | 6000 | BGA | Contact |
STM32F105RBT6 | ST | 2021 | 5888 | Contact | |
OV07955-N35V-PE | OV | 22+ | 88800 | CSP | Contact |